International Trade Fair of Packaging Technology and Labeling
16.01.2023
Poznań, Poland
Between September the 26th and 28th in Poznań an International Trade Fair of Packaging Technology and Labeling will be held.
TAROPAK are considered to be the largest forum in this part of Europe. The event is well known for presenting The latest technological solutions. The fair provides an opportunity to learn about the latest offerings and observe trends in the packaging industry, both in terms of production, materials used, as well as design or purpose.
The main fields of the event are:
- Raw materials and semi-products
- Packing materials
- Packaging and auxiliary packaging measures
- Co-packaging
- Labeling
- Packing machines and equipment
- Machines for production of packing
- Storage
- Specialized publishers
- Associations, institutions, Associations
For more information check the official site of the event.
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DCD-SEMI specializes in the design & development of high-performance semiconductor components. We provide advanced solutions for industries such as telecommunications, automotive, and consumer electronics. Our core export products include custom IP Cores and SoCs (ASICs&FPGAs), tailored to meet the specific needs of our clients. With a commitment to innovation and quality, we support companies worldwide in creating cutting-edge technologies and achieving market success.
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