International Trade Fair of Packaging Technology and Labeling
16.01.2023
Poznań, Poland
Between September the 26th and 28th in Poznań an International Trade Fair of Packaging Technology and Labeling will be held.
TAROPAK are considered to be the largest forum in this part of Europe. The event is well known for presenting The latest technological solutions. The fair provides an opportunity to learn about the latest offerings and observe trends in the packaging industry, both in terms of production, materials used, as well as design or purpose.
The main fields of the event are:
- Raw materials and semi-products
- Packing materials
- Packaging and auxiliary packaging measures
- Co-packaging
- Labeling
- Packing machines and equipment
- Machines for production of packing
- Storage
- Specialized publishers
- Associations, institutions, Associations
For more information check the official site of the event.
- Everything
-
Institution
Modern Buildings Association
The mission of the Modern Building Association is to integrate the building industry in order to ini…
InstitutionAssociation of Household Appliance Employers
APPLiA is an association of household appliance employers representing household appliance manufactu…
InstitutionPOLISH CHAMBER OF SHOE AND LEATHER INDUSTRY
The Polish Chamber of Shoe and Leather Industry is an industry organisation engaging in activities a…
InstitutionPolish Cement Association
The fundamental aim of the Polish Cement Association is to develop a cement industry in Poland. The …
InstitutionPolish Chamber of Organic Food
Polish Chamber of Organic Food is a sector organization which associates farmers, producers, process…
The Export Promotion Portal uses cookies to make it easier for users to use the website and for statistical purposes. If you do not block these files, you agree to their use and saving in the memory of your computer or other device. Remember that you can change your browser settings to block the storage of cookies. More information can be found in Privacy Policy and Terms and conditions.