Warsaw Pack 2025
14.11.2024
Poland, Nadarzyn near Warsaw
Warsaw Pack is the International Trade Fair for Packaging Technology and Packaging. This specialist industry event will take place between April 8th-10th 2025 at the largest Trade Fair Centre in Central and Eastern Europe – Ptak Warsaw Expo in Nadarzyn near Warsaw.

The Warsaw Pack fair aims to bring together all branches of the packaging industry and create favourable conditions for professional business contacts.
The event will be enriched with training sessions, conferences and speeches by leaders from the packaging industry.
Last year’s edition gathered 23,884 visitors and 511 exhibitors from 54 countries from around the world.
More information and registration on the event organizer’s website
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OMIS SPÓŁKA AKCYJNA
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DCD-SEMI SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ
DCD-SEMI specializes in the design & development of high-performance semiconductor components. We provide advanced solutions for industries such as telecommunications, automotive, and consumer electronics. Our core export products include custom IP Cores and SoCs (ASICs&FPGAs), tailored to meet the specific needs of our clients. With a commitment to innovation and quality, we support companies worldwide in creating cutting-edge technologies and achieving market success.
DIGITAL CORE DESIGN SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ
ServicesIT and TelecommunicationElectronics and household appliancesDomestic appliancesElectronicsIT and telecommunication equipmentOther goodsShow allDigital Core Design Sp. z o.o. is a leading provider of intellectual property (IP) cores, specializing in the design and development of microprocessor solutions. With over two decades of experience, the company has delivered more than 1bln innovative products and services that empower a wide range of industries, including automotive, industrial automation, and telecommunications. Our main export offerings include IP cores for 32/16/8-bit microcontrollers, RISC-V processors, and much, much more.
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